The Flip Chip Market size is expected to reach USD 43.65 billion by 2027; this converts into a compound annual growth rate (CAGR) of 7.08% for the forecast period 2021 – 2027.
Initially introduced by IBM more than 30 years ago, the Flip-chip Market technology is able to serve advanced packaging such as the 2.5D ICs and 3D ICs due to the development of new bumping solutions. The introduction of the copper pillar and micro-bumping metallurgy has expanded the application base in various end-user verticals. Owing to its benefits, flip chips are widely accepted even in low-range applications in certain cases. The rising demand for flip chips will therefore ensure the growth of the market during the forecast years.
The development in the IoT sector coupled with the rising demand for portable electronics has created an upsurge in the demand for flip chips. Moreover, a higher I/O capability, superior thermal & electrical performance, and more are making this technology more popular among various organizations. The widening application base is further boosting the market growth. Flip chips are comparatively expensive than their counterpart – wire bonding. Also, this technology does not permit customization/modifications after it is manufactured. The high cost and fewer customization options could restrict the overall market growth.
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A flip-chip, also known as a controlled collapse chip connection, is a method to interconnect semiconductor devices to external circuitry. This technique involves the deposition of bumps on chip pads on the top side of the wafer. It is then flipped over and aligned with its respective matching pads on the external circuit with the solder reflowed to complete the interconnect.
Key Players covered in the Flip Chip Market report is:
- 3m
- Advanced Micro Devices Inc.
- Amkor Technology
- Apple Inc.
- Fujitsu Limited
- Intel Corporation
- International Business Machines Corporation
- Samsung Electronics Co. Ltd.
- Taiwan Semiconductor Manufacturing Company Limited
- Texas Instruments Incorporated
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The high equipment cost is one of the major factors that Hampers the growth of the Flip Chip market. Moreover, the increasing automation at the construction sites is expected to provide significant opportunities Flip Chips. Furthermore, the unpredictable layout of the construction sites is one of the major challenges that limits the growth of the global Flip Chip market.
Flip Chip Market by Packaging Technology:
- 3D IC
- 2.5D IC
- 2D IC
Flip Chip Market by Bumping Technology:
- Copper pillar
- Solder bumping
- Gold bumping
- Others (Aluminium & Conductive Polymer)
Flip Chip Market by Region Outlook:
- North America
- Europe
- Asia Pacific
- Latin America
- Middle East & Africa
In terms of geography, The Asia Pacific region is expected to grow at a rapid pace owing to the presence of abundant natural resources like minerals, ores, among others, in countries like China, India, Australia, Malaysia, and other Asian countries. These countries carry out mining and construction activities to extract natural resources in the region. The construction industry of the region has started adopting Flip Chips for site inspection and for speeding up construction activities on site.
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Recent News:
- The development of the industry’s first 12-layer 3D TSV technology, by Samsung Electronics Co. Ltd. in July 2019, will feature faster speed and lower power consumption as compared to the wire bonding technology.
- In December 2020, Intel announced the discontinuation of part numbers using leaded solder bumps on the 1st level interconnect for a few field-programmable gate arrays (FPGA) flip-chip product families.
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